Xu, Wei; Lu, T. J.; Wang, F. Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics. (English) Zbl 1194.74185 Int. J. Solids Struct. 47, No. 14-15, 1830-1837 (2010). Summary: Polymer-supported metal films as interconnects for flexible, large area electronics may rupture when they are stretched, and the rupture strain is strongly dependent upon the film/substrate interfacial properties. This paper investigates the influence of interfacial properties on the ductility of polymer-supported metal films by modeling the microstructure of the metal film as well as the film/substrate interface using the method of finite elements and the cohesive zone model (CZM). The influence of various system parameters including substrate thickness, Young’s modulus of substrate material, film/substrate interfacial stiffness, strength and interfacial fracture energy on the ductility of polymer-supported metal films is systematically studied. Obtained results demonstrate that the ductility of polymer-supported metal films increases as the interfacial strength increases, but the increasing trend is affected distinctly by the interfacial stiffness. Cited in 1 Document MSC: 74K35 Thin films Keywords:metal film; flexible substrate; ductility; cohesive zone model; interface PDFBibTeX XMLCite \textit{W. Xu} et al., Int. J. Solids Struct. 47, No. 14--15, 1830--1837 (2010; Zbl 1194.74185) Full Text: DOI References: [1] Balzani, C.; Wagner, W.: An interface element for the simulation of delamination in unidirectional fiber-reinforced composite laminates, Engineering fracture mechanics 75, 2597-2615 (2008) [2] Beuth, J. 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