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Numerical simulation of nucleation and migration voids of interconnects of electrical circuits. (Russian. English summary) Zbl 1140.65344
A new physical-mathematical model of voids nucleation and migration in interconnects of electrical circuits is proposed. The model based on migration-diffusion approximation and it is included the quasi-stationary equations of electrodynamics and thermo-mechanics. For analysis of the model proposed the nonlinear conservative homogeneous difference schemes on adaptive rectangular grids are constructed.
MSC:
65M06 Finite difference methods for initial value and initial-boundary value problems involving PDEs
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