Measuring production and marketing efficiency using grey relation analysis and data envelopment analysis. (English) Zbl 1197.90270

Summary: The aim of this paper is to measure production and marketing efficiencies in the printed circuit board (PCB) industry using grey relation analysis (GRA) and data envelopment analysis (DEA) techniques. A total of 32 efficiency indicators are initially considered and seven are selected. They represent five indicators for production efficiency and two for marketing efficiency. Fifteen of the 23 companies evaluated need improvement in both production and marketing efficiencies, while four companies had their priority production efficiency improvement and the remaining four companies with priority in marketing efficiency improvement.


90B60 Marketing, advertising
90B50 Management decision making, including multiple objectives
90C05 Linear programming


DEAFrontier; Excel
Full Text: DOI


[1] DOI: 10.1287/mnsc.30.9.1078 · Zbl 0552.90055
[2] DOI: 10.1080/12265080500292633
[3] Chang, CC and Cong, J. 1997. An efficient approach to multi-layer layer assignment with application to via minimization.In:Proceedings of the 34th design automation conference.9–13 June. 1997, Anaheinm, USA. California: Anaheinm Convention Center. 600–603
[4] DOI: 10.1016/0377-2217(78)90138-8 · Zbl 0416.90080
[5] Chen DJ, Transportation Planning Journal 23 pp 11– (1994)
[6] Chenard, JS and Chu, CY. 2005. Design methodology for wireless nodes with printed antennas. Proceedings of the 42nd design automation conference. 13–17 June2005, Anaheinm, California, USA. pp.512–519. Anaheinm Convention Center.
[7] Deng JL, Systems and Control Letters 5 pp 288– (1982)
[8] Deng JL, The Journal of Grey Systems 1 pp 1– (1989)
[9] DOI: 10.1080/00207540050031896 · Zbl 0961.90502
[10] Farrell MJ, Journal of the Royal Statistical Society, Series A 120 pp 258– (1957)
[11] DOI: 10.1016/S0969-6997(00)00003-X
[12] Feng CM, Journal of Eastern Asia Society for Transportation Studies 4 pp 13– (2001)
[13] DOI: 10.1080/01441640010020304
[14] DOI: 10.1080/00207540050205064
[15] Harvel, JT. 1978. Classification of PCB types for cost effective solutions.In:Proceedings of the 15th design automation conference. 19–21 June1978, Las Vegas. Nevada, USA, 444–445
[16] Lohan, J. 2000. Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection.In:Proceedings of inter society conference on thermal phenomena. 23–26 May2000, Las Vegas, USA. Nevada 213–225
[17] DOI: 10.1016/S0377-2217(03)00108-5 · Zbl 1107.90377
[18] DOI: 10.1080/00207540412331299639 · Zbl 1068.90580
[19] Zhu J, Quantitative models for performance evaluation and benchmarking data envelopment analysis with spreadsheets and DEA Excel Solver (2002)
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