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An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction. (English) Zbl 1293.74302

Summary: Thermomechanical loading, in the same way that mechanical loading can cause significant stress violations, may give rise to significant stress variations and concentrations and in some circumstances can result in structural destruction or even failure. This clearly shows the importance of accurate stress analysis of thermal-loaded structures. This paper presents three-dimensional thermomechanical stress analysis of heterogeneous adhesively bonded joints undergoing steady-state one-dimensional heat conduction using the full layerwise theory. In this approach, the fully coupled three-dimensional governing equilibrium equations are derived generally for an orthotropic joint based on the use of variational calculus and the principle of minimum total potential energy. The through-thickness temperature distribution is determined using the equivalent thermal-resistant model and is rewritten in the layerwise form. The governing equations of equilibrium then are analytically solved using the state space approach. The accurate results presented in this study are compared and verified via analytical as well as numerical investigations, and the study shows rapid converging solutions.

MSC:

74K30 Junctions
74F05 Thermal effects in solid mechanics

Software:

ABAQUS
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References:

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